HIKROBOT MV-SC6500P-AI-WID-IBN — Smart Cameras & Vision Sensors

The MV-SC6500P-AI-WID-IBN is not a general-purpose imaging camera but a Wafer ID Reader purpose-built to read identification marks on semiconductor wafers. It provides SEMI-standard semiconductor character OCR recognition alongside DataMatrix, QR code and barcode reading, and it is fitted with a near-infrared (NIR) LED illumination source chosen specifically to read wafer ID marks even under conditions where they are difficult to read with standard visible light.

Alongside the VisionMaster (VM) platform, dedicated SCClient client software is provided for the wafer-reading workflow. The camera’s NIR LED system can freely combine bright-field and dark-field illumination methods, aimed at improving ID readability across different wafer surface coatings and process steps. A recommended mounting height of 40–50 mm and a depth of field of ±5 mm, together with automatic focus, provide precise and repeatable positioning.

Specifications

Key features

• Adopts AI algorithm to recognize wafer ID information.
• Supports advanced optical imaging system with multiple lighting methods.
• Integrates VM functions, and supports more than 140 algorithms.
• Adopts high-performance CPU with faster calculation performance and high efficiency.
• Supports multiple communication protocols.
• Supports indicators displaying device status for easy debugging and maintenance.

Where it is used

This model is used for wafer ID tracking and process traceability inside a semiconductor fab, particularly at stations where the wafer surface’s contrast has changed after certain process steps (such as thin-film coating or specific etch/deposition processes) or where reading the ID under visible light has become difficult. NIR illumination’s relatively better penetration through some surface coatings helps maintain uninterrupted wafer identity tracking across front-end or back-end process steps.

Suitability depends on working distance, field of view, target characteristics and positioning. Selection is assessed on a per-project basis.