ADVANTECH MIC-712-OX — NVIDIA AI PC

Ultra-slim AI platform based on NVIDIA Jetson Orin NX (up to 157 TOPS) — for mobile equipment, safety and security; 8/16 GB LPDDR5, 2 × GbE, HDMI 4K, 4 × USB 3.2 Gen2, M.2 NVMe, M.2 E key Wi-Fi + M.2 B key 5G, optional GMSL/PoE/TPM/COM/CAN, built-in OOB management, 19 – 36 VDC, −25 to 70 °C. Listed as “New” by Advantech.

ADVANTECH MIC-712-OX

Status: In production

Product: Ultra-slim AI platform — Jetson Orin NX, 157 TOPS, mobile equipment

AI module: Jetson Orin NX 8 / 16 GB · up to 157 TOPS

Interfaces: 2 × GbE · HDMI · 4 × USB 3.2 Gen2 · M.2 E/B key

Storage: M.2 2280 NVMe (128 GB pre-installed on A1 SKU) · Micro SD

Environment: −25 to 70 °C (25 W) · 19 – 36 VDC · fanless

Request a quote for price and stock

MIC-712-OX is the ultra-slim member of the MIC-71x family aimed at mobile equipment: NVIDIA Jetson Orin NX (8 or 16 GB LPDDR5, 1024 CUDA cores, 32 Tensor Cores) delivers up to 157 TOPS of AI inference in JetPack 6.2 Super mode. The 160 × 160 × 60 mm, 2.05 kg fanless body has two Gigabit Ethernet, HDMI 4K, four USB 3.2 Gen2 and two Micro USB ports for console and OTG. Storage is an M.2 2280 PCIe ×4 SSD (128 GB pre-installed on A1 SKUs) and Micro SD. The 19 – 36 VDC input suits 24 V vehicle and mobile-machine supplies; it operates from −25 to 70 °C in 25 W power mode and −25 to 50 °C in 40 W mode.

Expansion is via M.2 E key 2230 (Wi-Fi 6 + Bluetooth), M.2 B key 3052 (5G Sub-6 + GNSS) and nano SIM; a 4-channel GMSL2 frame grabber (MIC-FG-4G2C1) on the on-board MIPI connector connects vehicle cameras directly. One RS-232/422/485 and one CANBus port from on-board pin headers, an optional TPM 2.0 module and an audio cable can be added; out-of-band (OOB) management is integrated. 3 Grms vibration and 10 G shock resistance and CE/FCC/UKCA/CB/UL/BSMI/CCC certification apply (no RED; a radio module needs regional approval). Advantech’s web page also mentions an Orin Nano option; the datasheet dated 16 April 2026 lists Orin NX SKUs only.

Technical specifications

MIC-712-OX
Processor system (Jetson module)
Jetson moduleNVIDIA Jetson Orin NX — up to 157 TOPS (Super mode)
CPU16 GB: 8-core NVIDIA Arm Cortex-A78AE v8.2 64-bit (2 MB L2 + 4 MB L3); 8 GB: 6-core (1.5 MB L2 + 4 MB L3)
GPU1024-core NVIDIA Ampere GPU with 32 Tensor Cores
Memory16 GB or 8 GB LPDDR5
I/O
Ethernet2 × 10/100/1000 Mbps
Display1 × HDMI, max. 3840 × 2160 @ 60 Hz
USBExternal: 4 × USB 3.2 Gen2
Debug / OTG1 × Micro USB (console), 1 × Micro USB (OTG)
Optional interfaces1 × RS-232/422/485 and 1 × CANBus (on-board pin headers, cable 1700019116); audio (line-in + mic, cable 1700027920-01)
Expansion and storage
M.2 E key1 × M.2 2230 E key (PCIe + USB 2.0) — Wi-Fi 6 module
M.2 B key1 × M.2 3052 B key (USB 3.2) — 5G module; 1 × nano SIM
GMSL1 × MIPI connector (optional 4-ch GMSL2 frame grabber MIC-FG-4G2C1)
TPM1 × TPM 2.0 (optional PCA-TPMSPI-00A1)
Storage1 × M.2 2280 (PCIe ×4; 128 GB SSD pre-installed on A1 SKUs); 1 × Micro SD
Power
Power modeAT
Input voltage19 – 36 VDC
Environment
Operating temperature−25 to 70 °C (25 W power mode) / −25 to 50 °C (40 W power mode), with 0.7 m/s airflow
Operating humidity95 % @ 40 °C (non-condensing)
Vibration3 Grms @ 5 – 500 Hz, random, 1 hr/axis
Shock10 G / 11 ms
Mechanical and software
Dimensions (W × D × H)160 × 160 × 60 mm
Weight2.05 kg (without packing)
InstallationDesktop; wall bracket in the box, DIN-rail bracket optional
BSPJetPack 6.2 or above
Remote managementOut-of-band (OOB) management integrated in the system
Certification
EMC / safetyCE, FCC, UKCA, CB, UL, BSMI, CCC (no RED certification)
NoteNo RED certification: adding a Wi-Fi/5G module requires separate regional radio approval.

Key features

  • Ultra-slim design (160 × 160 × 60 mm) for mobile equipment in safety and security applications
  • NVIDIA Jetson Orin NX — up to 157 TOPS with Super mode (the web feature list also mentions an Orin Nano option; the datasheet lists Orin NX only)
  • 2 × GbE, 4 × USB 3.2 Gen2, HDMI 4K
  • Multiple expansions for GMSL, PoE and USB; optional TPM 2.0, COM and CANBus
  • M.2 E key Wi-Fi 6, M.2 B key 5G, nano SIM
  • Out-of-band (OOB) management integrated in the system
  • −25 to 70 °C wide operating range (25 W mode)

Ordering information

Part numberDescription
MIC-712-OX4A1Jetson Orin NX 16 GB, JetPack 6.2, 128 GB NVMe SSD pre-installed, Super mode
MIC-712-OX3A1Jetson Orin NX 8 GB, JetPack 6.2, 128 GB NVMe SSD pre-installed, Super mode
MIC-712-OX4A2Jetson Orin NX 16 GB, no SSD/BSP included (customer provides SSD and installs JetPack 6.2), Super mode
MIC-712-OX3A2Jetson Orin NX 8 GB, no SSD/BSP included (customer provides SSD and installs JetPack 6.2), Super mode

Part number: 4 = 16 GB, 3 = 8 GB, 2 = 4 GB module; A2/B2 = JetPack 6.2 + 128 GB NVMe pre-installed, A3/B3 = no SSD/BSP. Wireless modules and the GMSL card are ordered separately.

Accessories and optional items

Part numberDescription
96PSA-A120W24T2-4Power adapter 100 – 240 V, 120 W, 24 V (C14)
1702002605Power cord, EU plug, C13, 1.83 m
EWM-W179M201EWi-Fi 6 + Bluetooth M.2 A/E key module; antenna 1751000460-01, cable 1751000620-01
AIW-356-DQ5G Sub-6 + GNSS M.2 3052 B key module (by region); 4 × antenna 1750009372-01, cable 1751000624-01
PCA-TPMSPI-00A1TPM 2.0 module (optional)
1700019116COM / CANBus cable
1700027920-01Audio port cable (1 × line-in + 1 × mic)
MIC-FG-4G2C14-ch GMSL2 video capture card (FAKRA); RF cable 1751000805-01 per camera
1960095312N001DIN-rail bracket

Is this AI system right for your project?

Share the number and interface of cameras (USB3, GigE, GMSL), your inference model and target frame rate, the mounting location and ambient conditions; let’s decide on the Jetson module (Nano/NX, memory), storage and wireless options together. FST delivers the Jetson system together with the HIKROBOT camera/lens/lighting layer and model commissioning services as one solution.

Request a quote Back to the MIC-711 / 712 / 713 Series

All product specifications are subject to change without notice; data compiled from Advantech’s MIC-712-OX datasheet dated 16 April 2026 and the advantech.com product page.

Source: Advantech product data