ADVANTECH MIC-770V3H-00A1 — Compact Modular PC
Intel Core 12th / 13th / 14th Gen and Core Series 2 (Bartlett Lake-S) processor support (LGA1700 socket), fanless, compact modular industrial computer — Intel H610E chipset, standard chassis.
Status: Available
Advantech part no.: MIC-770V3H-00A1
Processor generation: Intel Core 12th / 13th / 14th Gen and Core Series 2 (Bartlett Lake-S)
Chipset: Intel H610E
Chassis: Standard (77 × 192 × 230 mm, 2.8 kg)
Request a quote and stock checkMIC-770V3H-00A1 is the H610E-chipset, economy standard-chassis model in the MIC-770 V3 series. The LGA1700 socket lets it be configured with Intel 12th, 13th and 14th Gen Core i processors and the Core Series 2 (Bartlett Lake-S) family. It costs less than its R680E siblings, and is designed for applications where standard storage and USB connectivity are enough, without a need for ECC memory, RAID or NVMe M.2.
The H610E chipset differs from R680E in three respects: no ECC memory or RAID support, no NVMe M.2 slot (only 2.5″ HDD/SSD and mSATA), and no USB 3.2 Gen2 port (4 × USB 3.2 Gen1 + 4 × USB 2.0 instead). Advantech’s MIC-75M20-01 and MIC-75G30 i-Modules are not supported on this model — projects needing larger GPU/expansion capacity should use an R680E model instead. FlexIO and iDoor slots, other i-Modules, and basic serial/digital I/O expansion are all supported as usual.
Specifications
| MIC-770 V3 Series | |
|---|---|
| Model | MIC-770V3H-00A1 |
| Platform | |
| Processor generation | Intel Core 12th / 13th / 14th Gen and Core Series 2 (Bartlett Lake-S) |
| Processor socket | 1 × LGA1700 (processor selected at order time; up to 24 cores, up to 65 W) |
| Chipset | Intel H610E |
| BIOS | AMI 256 Mb SPI Flash |
| Memory and storage | |
| Memory | Dual-channel DDR5 4800 MHz (no ECC); 2 × 262-pin SO-DIMM (64 GB per slot), up to 128 GB |
| Storage | 1 × 2.5″ HDD/SSD (optional dual 2.5″ SSD kit; 2 × 3.5″ HDD via i-Module), 1 × mSATA — no NVMe M.2 slot |
| RAID | Not supported |
| Display and network | |
| Graphics | Intel UHD Graphics 770 (on Core i processors) |
| Display output | 1 × VGA (DB15, 1920 × 1200), 1 × HDMI (4096 × 2160 @ 30 Hz); 3 independent displays (3rd output via optional cable) |
| Ethernet | 2 × RJ45 10/100/1000 Mbps — LAN1: Intel I219-V, LAN2: Intel I210-IT |
| I/O | |
| USB | 4 × USB 3.2 Gen1, 4 × USB 2.0 |
| Serial port | 2 × DB9 RS-232/422/485 (auto flow control); optional 4 × RS-232 |
| Audio | 1 × line-out, 1 × mic-in |
| Expansion | 1 × Mini PCIe; FlexIO and iDoor slots; MIC-75 series i-Module (PCIe/PCI — MIC-75M20-01/MIC-75G30 GPU modules excepted) |
| LED / switch | 2 status LEDs (storage, power), 4 COM TX/RX LEDs; power switch; optional remote switch (2-pin terminal block) |
| Power | |
| Input voltage | 9–36 VDC |
| Power consumption | Typical 45.7 W, maximum 108 W |
| Power type | ATX / AT |
| Watchdog | System reset; programmable 1–255 sec/min |
| Environmental | |
| Operating temperature | 35 W CPU: −20–60 °C (0.7 m/s airflow) / 65 W CPU: −20–50 °C (0.7 m/s airflow); with industrial wide-temperature SSD |
| Storage temperature | −40–85 °C |
| Humidity | 95% @ 40 °C, non-condensing |
| Vibration | With SSD: 3 Grms @ 5–500 Hz, random, 1 hr/axis; with 2.5″ HDD: 1 Grms |
| Shock | With SSD: 20 G, IEC-68-2-27, half-sine wave, 11 ms |
| Ingress protection | IP40 (dust) |
| Mechanical | |
| Dimensions (W × H × D) | 77 × 192 × 230 mm (Standard chassis) |
| Weight | 2.8 kg |
| Mounting | Desktop / wall; optional DIN-rail kit |
| General | |
| Certifications | EMC: CE / FCC Class A, CCC, BSMI — Safety: CB / UL, CCC, BSMI |
| Operating system | Windows 11, Windows 10, Windows 10 IoT, Linux |
| Country of origin | China |
| Status | Available |
Key features
- Intel 12th/13th/14th Gen Core i processor support, LGA1700 socket, Intel H610E chipset
- Wide operating temperature range (Standard chassis)
- VGA and HDMI output
- 2 × GigaLAN, 4 × USB 3.2 Gen1 and 4 × USB 2.0
- 2 × RS-232/422/485 and an optional 4 × RS-232 serial ports
- 1 × 2.5″ HDD/SSD and 1 × mSATA
- 9–36 VDC input power range
- IP40 dust protection for harsh environments
- FlexIO and iDoor technology: extra HDMI, DP, DVI, COM ports, DIO and a remote power switch can be flexibly configured
- Advantech i-Module support (PCIe/PCI expansion, extra storage, GPU modules MIC-75M20-01/MIC-75G30 excepted)
- Advantech SUSIAPI and embedded software API support
- Intel vPro/AMT and TPM technology support
- Out-of-band remote power management via Advantech iBMC 1.2 and DeviceOn
iDoor expansion modules
MIC-770 V3 supports Advantech iDoor technology: Mini PCIe-based iDoor modules fit the front-panel iDoor slot, adding fieldbus, serial ports, digital I/O, extra Ethernet or wireless connectivity without swapping a card. The modules below are compiled from Advantech’s current iDoor catalogue.
| Function | Module | Description |
|---|---|---|
| Industrial fieldbus | PCM-26R2PN | 2-port PROFINET, Hilscher netX100, RJ45 |
| PCM-26R2EC | 2-port EtherCAT, Hilscher netX100, RJ45 | |
| PCM-26R1EC | 1-port EtherCAT I/O MainDevice | |
| PCM-26R2EI | 2-port EtherNet/IP, Hilscher netX100, RJ45 | |
| PCM-26D1DB | 1-port PROFIBUS, Hilscher netX100, DB9 | |
| PCM-26D2CA | 2-port isolated CANBus (CANopen), DB9 | |
| Serial communication | PCM-24D2R2 | 2-port isolated RS-232, DB9 |
| PCM-24D2R4 | 2-port isolated RS-422/485, DB9 | |
| PCM-24D4R2 | 4-port non-isolated RS-232, DB37 | |
| PCM-24D4R4 | 4-port non-isolated RS-422/485, DB37 | |
| Digital I/O | PCM-27D24DI | 24-channel isolated digital I/O with counter, DB37 |
| Ethernet and wireless | PCM-24R1TP | 1-port 2.5 GbE, Intel I225, IEEE 1588 / TSN, RJ45 |
| PCM-24R2GL | 2-port Gigabit Ethernet, Intel I350, RJ45 | |
| PCM-24S2WF | Wi-Fi / Bluetooth, 2 × SMA antenna | |
| PCM-24S34G | LTE / HSPA+ / GPRS, SIM slot, 4G antenna | |
| Storage and peripherals | PCM-24U2U3 | 2-port USB 3.0, USB-A |
| PCM-2300MR | 4 MB MRAM (MR4A16B) | |
| PCM-23U1DG | Lockable USB dongle slot | |
| PCM-23C1CF | CFast slot with cover |
Advantech notes MIC-770 V3 supports MOS and PCM series iDoor modules, excluding the PoE model (PCM-24R2PE); the PCM series requires the separately ordered bracket 1960065854N021. Please confirm compatibility with us before ordering.
Other models in the series
MIC-770V3W-00A1
R680E chipset · Standard chassis
77 × 192 × 230 mm · 2.8 kg
12th/13th/14th Gen Core · Core Series 2
MODEL PAGEMIC-770V3W-00A2U
R680E chipset · Standard chassis
77 × 192 × 230 mm · 2.8 kg
12th/13th/14th Gen Core · Core Series 2
MODEL PAGEMIC-770V3W-E0A1
R680E chipset · Extreme chassis
107.3 × 192 × 230 mm · 4.5 kg
12th/13th/14th Gen Core · Core Series 2
MODEL PAGEMIC-770V3H-E0A1
H610E chipset · Extreme chassis
107.3 × 192 × 230 mm · 4.5 kg
12th/13th/14th Gen Core · Core Series 2
MODEL PAGEWhere it’s used
A SCADA/HMI server mounted in a control cabinet on the factory floor; a vision-processing computer driving camera and lighting in a machine-vision system (with a GPU added via i-Module for edge AI inference); production-line data acquisition and a MES/ERP gateway; field stations where heat and vibration call for a fanless system.
These are typical use cases; check with our technical team on fit for your project.
Is this industrial computer right for your project?
Let’s configure the processor generation, memory, storage and expansion modules to match your workload. FST commissions the industrial computer together with the machine-vision camera, lens and lighting as a single system.
All product specifications are subject to change without notice; data compiled from Advantech’s MIC-770 V3 datasheet dated 6 February 2026.
Source: Advantech product data