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TPC-B520

TPC-B520

Modular TPC – Computing Box Module with Intel® Core™ processors (13th gen)
Key Features
  • Modular Computing Box powered by Intel® Core™ processors (13th gen) i5-1335UE deca-core/ i7-1365URE deca-core processor
  • Single DDR5 Memory slot supports up to 32GB
  • Support expansion via three M.2 slots (NVMe, Wifi, 5G)
  • LAN, POE, isolated serial port and isolated digital I/O via iDoor technology
  • Support Type C connector with USB 3.2, DP 1.4a, 15W power delivery
  • Support fieldbus protocols/GPS/GPRS/Wi-Fi capabilities via iDoor technology
  • Modular Front Panel modules ranging from 12.1" to 23.8" with P-CAP multi-touch in selection (12.1", 15", 15.6", 21.5" with high brightness panel option)
Detailed Specifications
Environment — Operating TemperatureTPC-B520-D50A: -10~60 °C (14~140 °F) | TPC-B520-D70A: -20~60 °C (-4~140 °F)
Environment — Storage Temperature-30~70 °C (-22~158 °F)
Environment — Vibration Protection1 Grms, random
Environment — Shock Protection10 G, half sine
Hardware — CertificationCB/UL, CE, FCC Class A, CCC, BIS, BSMI, RoHS
Hardware — CPUTPC-B520-D50A: Intel® Core™ i5-1335UE 1.3GHz 10-Core | TPC-B520-D70A: Intel® Core™ i7-1365UE 1.7GHz 10-Core
Hardware — Hardware SecurityTPM 2.0
Hardware — I/O2 x RS-232/422/485, 2 x USB 3.1, 2 x USB 2.0, 1 x Type C, 1 x DP, 1 x iDoor Slot
Hardware — LAN2 x 2500 Mbps
Hardware — Storage1 x M.2 B key, 1 x 2.5" SSD/HDD Bay
Hardware — Expansion1 x M.2 E Key 2230
I/O Interface — Expansion1 x M.2 B key, 1 x M.2 E key
Expansion Function — SIM card slotNano SIM card
I/O Interface — Displays1 x DP
I/O Interface — Power Connector1 x 3-Pin Terminal Block
Mechanical — MountingPanel, Wall, Stand, VESA
Mechanical — Weight (Net)2.8 kg (6.17 lb)