TPC-B610

Modular TPC – Computing Box Module with Intel® Core™ processors (10th gen)

Key Features

High Performance Computing Box powered by Intel® 10th Gen. Core™ i CPU Socket (LGA1200) with fanless design
6 x Panel Modules (IP66) ranging from 15" to 23.8" in selection
Dual Channel Memory slots (DDR4) support up to 64GB in total
Comprehensive I/Os, including 6 x USB, 2 x COM, 2 x RJ45…etc
Supports Expansion via 1 x PCIe x16, 1 x mPCIe, 2 x M.2 (NVMe, SATA, 5G)
Supports Storage via 2 x 2.5" HDD/SSD (RAID 0/1), 2 x M.2 (2242/2280)
Supports Fieldbus protocols/GPS/GPRS/Wi-Fi capabilities via iDoor technology
Supports Diverse system I/O, DIO, PoE…etc. via iDoor technology
Supports TPM 2.0 hardware security

Detailed Specifications

Hardware — CPU	10th Gen. Intel® Core™i Socket CPU (LGA1200)
Hardware — Memory	TPC-B610H-A00A: 2 x SO-DIMM DDR4 2933 MHz Slots \| TPC-B610W-A00A: 2 x SO-DIMM DDR4 2933 MHz Slots, ECC supported
Hardware — Storage	TPC-B610H-A00A: 2 x 2.5" SSD/HDD Bay, 1 x M.2 M key 2280 (SATA), 1 x M.2 M key 2242 (SATA) \| TPC-B610W-A00A: 2 x 2.5" SSD/HDD Bay, 1 x M.2 M key 2280 (NVMe PCIe x4), 1 x M.2 M key 2242 (SATA)
Hardware — I/O	1 x RS-232/422/485, 1 x RS-232, 5 x USB 3.2, 1 x USB 2.0, 1 x Displayport 1.2, 1 x Line out/Mic in
Hardware — Power Requirement	24 VDC ±20%
Hardware — OS Support	Microsoft® Windows 10 2019 LTSC, Linux
Hardware — Certification	UL, CB, FCC, CE, CCC
Environment — Operating Temperature	-10~50 °C (14~122 °F)
Environment — Storage Temperature	-20~70 °C (-4~158 °F)
Mechanical — Dimension (W x H x D)	269 x 224 x 70 mm