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TPC-B620

TPC-B620

Modular TPC – Computing Box Module with Intel® 12th/13th/14th Gen./BTL S Core™ i CPU Socket (LGA1700)
Key Features
  • High Performance Computing Box powered by Intel® 12th/13th/14th Gen. Core™ i / BTL Core™ S-series CPUs Socket (LGA1700) with fanless design
  • 10+ x Panel Modules (IP66) ranging from 15" to 23.8" in selection
  • Dual Channel Memory slots (DDR5) support up to 64GB in total
  • Comprehensive I/Os, including 4 x USB, 2 x COM, 3 x RJ45…etc
  • Supports Expansion via 1 x PCIe x16, 1 x PCIe x4 or PCIe x2, 4 x M.2 (NVMe, SATA, WIFI)
  • Supports Storage via 2 x M.2 2280 SATA SSD (RAID 0/1), 1 x M.2 NVMe SSD (2280)
  • Supports Fieldbus protocols/GPS/GPRS/Wi-Fi capabilities via iDoor technology
  • Supports Diverse system I/O, DIO, PoE…etc. via iDoor technology
  • Supports TPM 2.0 hardware security
Detailed Specifications
Hardware — CPU12th/13th/14th Gen. Intel Core™ i / Intel® Core™ 200S CPU Socket (LGA1700)
Hardware — MemoryTPC-B620R-F00A: 2 x SO-DIMM DDR4 2933 MHz Slots, ECC supported | TPC-B620H-F00A: 2 x DDR5 SO-DIMM Slot
Hardware — Storage1 x M.2 M key 2280 (SATA/NVMe PCIe x4), 2 x M.2 M key 2280 (SATA), 1 x 2.5" SSD/ HDD (SATA)(Optional)
Hardware — I/O2 x RS-232/422/485, 4 x USB 3.2, 3 x RJ45, 1 x DP, 1 x HDMI, 1 x Audio (Line-In, Mic-In)
Hardware — Power Requirement24 VDC ±20%
Hardware — OS SupportMicrosoft® Windows 10, Microsoft® Windows 11, Linux
Hardware — CertificationUL, CB, FCC, CE, CCC
Environment — Operating Temperature-10~55 °C (14~131 °F)
Environment — Storage Temperature-20~70 °C (-4~158 °F)
Mechanical — Dimension (W x H x D)269 x 224 x 76 mm